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CPU MODULE (CPU II)

GATEWAY MAPPING SERVER AND APPLICATION PROCESSING MODULE

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Based on Power PC architecture

Gateway management functions

ISaGRAF® application executor

pSOS RTOS and ANSI Flash file system

Four high-speed general purpose serial interfaces

　

The CPU II module is capable of carrying out extensive Coach Computer functions; the gateway functions and coach application functions. The processing capacity is at least 500 source and 7.500 sink variables depending on equipment configuration.

Maximum delay in gateway function between the databuses is 50 ms. The module is based on the Motorola PowerQUICC processor on a piggy-pack board. The module’s QUICC core supports four high-speed serial channels, one of which can be used for the serial I/O Bus. TCN mapping server facilities are available also for these interfaces.

For application functions, the module has a configurable executor, the ISaGRAF® kernel. Users can also write their own C-tasks, either as an ISaGRAF® extension or on top of the module’s operating system kernel.

Properties and Interfaces:

Processor and memory. 32-bit MPC860

Power QUICC processor with up to 32 Mbytes

Flash EEPROM and up to 32 Mbytes SRAM

located on the PQP piggy-pack module.

Additional 15MB Flash memory is available

as an option. The CPU II module has BDMinterface

for emulation.

VMEbus interface. Master VMEbus (A24/D16) interface with bus arbiter logic. Interrupt handling and block transfer cycles supported.

Serial channels. Four programmable isolated asynchronous or bit-synchronous SCCchannels for application purposes.

Software interface with the TCN gateway.

Real-Time Clock. Date/time type RTC with capacitor back-up facility for application purposes.

ISaGRAF® interface. This interface is reserved by ISaGRAF® Workbench for application development purposes. PST interface. This interface is for user Event log operations, software downloading and application development purposes.

Technical Information:

DIMENSIONS: 4 TE x 3 U x 160 mm (W x H x D),

weight TBD g

INPUT POWER: 5 VDC +- 5% (TBD mA max, TBD mA typ.)

MTBF: 300 000 h (25°C)

TEMPERATURE RANGE: Operational -40°C ... +70°C

I/O BUS: One channel may be used for

communication with I/O modules

via the back panel

SERIAL INETRFACE (4 CHANNELS)

Data Rate: Up to 2 Mbps

Protocol: asynchronous or SDLC based, application

dependent (Modbus, BITBUS™, FIP,

Profibus etc)

Electrical: Optically isolated, RS422 or

RS485 (at front)

VMEbus (IEC 821)

Interface: A24/D16 Master with the arbitration logic